发明名称 ADHESIVE FOR CONNECTING CIRCUITS, AND CIRCUIT CONNECTING METHOD AND CONNECTION STRUCTURE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide an adhesive for connecting circuits, a circuit connecting method and a connection structure using the same, effectively used, even when intervals among circuits become narrow. SOLUTION: This adhesive for connection circuits is placed between the boards respectively having circuit electrodes opposite to each other for electrically connecting the electrodes in the pressing direction, by heating and pressing the boards having the circuit electrodes. The adhesive has a first adhesive layer and a second adhesive layer, the number of conductive particles included in the first adhesive layer is more than the number of conductive particles included in the second adhesive layer, and flow time of the first adhesive layer is shorter than that in the second adhesive layer in connection.</p>
申请公布号 JP2003045515(A) 申请公布日期 2003.02.14
申请号 JP20010231899 申请日期 2001.07.31
申请人 HITACHI CHEM CO LTD 发明人 YUSA MASAMI;GOTO YASUSHI;WATANABE OSAMU
分类号 C09J7/00;C09J5/04;C09J9/02;H01B1/22;H01B1/24;H01B5/16;H01R11/01;H05K1/14;H05K3/32;(IPC1-7):H01R11/01 主分类号 C09J7/00
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