| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination wiring board which makes filing of a via hole easy when an interlayer connection structure, wherein the thickness of an insulation layer is relatively large, is formed and enables high density pattern formation. SOLUTION: A hole is made by etching a resin board consisting of copper foils 11, 12 and a resin layer 10, whose both sides are coated with copper. Laser processing is carried out from each hole and a hole 13 shaped by confronting tapered top parts each other is formed. Then, the hole 13 is filled by filled plating. A circuit pattern is formed in a copper plating layer 41 and the copper foils 11, 21 of a lamination wiring board in the state. Consequently, a lamination wiring board 1000, wherein a conductor layer 100 and a conductor layer 200 are subjected to interlayer connection by the via hole 13, is manufactured. |
