TAPE CARRIER FOR SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device where a prescribed lead strength can be secured by preventing the occurrence of copper corrosion cracks on an inner lead. SOLUTION: In a method for manufacturing the tape carrier for the semiconductor device, the lead 13 of a prescribed pattern is formed on a polyimide tape 11, and this lead 13 is subjected to Sn plating 21. After this plating a prescribed portion of the lead 13 is coated with solder resist 14.