| 摘要 |
PROBLEM TO BE SOLVED: To provide a lamination wiring board which enables high density pattern formation and its manufacturing method by making charging of a via hole easy when an interlayer connection structure, wherein the thickness of an insulation layer is relatively large, is formed. SOLUTION: A land 12 is formed in one side of a resin board consisting of copper foils 11, 12 and a resin layer 10, whose both sides are covered with copper. Prepreg is combined with an upper side of the land 12 and a copper foil 21 is combined with an upper side thereof. The combined resin board or the like are pressed while heated. Via holes 13, 23, whose bottom surface is the land 12, are formed to the resin layer 10 and a resin layer 20 formed of set prepreg. The via holes 13, 23 are charged by filled plating. A circuit pattern is formed in copper plating layers 41, 42 and the copper foils 11, 21 of a lamination wiring board in the state. As a result, a lamination wiring board 1000 wherein the copper foil 11 and the copper foil 21 are subjected to interlayer connection via the land 12 is manufactured. |
