| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a two-layer printed circuit board which is capable of obtaining a hyperfine circuit pattern arranged at a pitch of 80μm or below with high yield. SOLUTION: In a method of manufacturing a two-layer printed circuit board where a conductive metal layer and a copper plating layer are successively formed on an insulating film, a conductive metal layer is formed on either or both of the surfaces of the insulating film equipped with no adhesive layer by deposition, then a conductive metal layer is attracted through a chemical method to an exposed part of the insulating film where conductive metal is not deposited, and furthermore the copper plating layer is formed thereon.
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