SOLID-STATE IMAGE PICKUP DEVICE

摘要

PROBLEM TO BE SOLVED: To form a construction at low cost and reduce the number of assembling processes by using an adhesive for fixing a lens holder and at the same time by allowing the adhesive to function as a reinforcing member for mounting a substrate on a solid-state image pickup device. SOLUTION: A laminated chip 6 is mounted on a substrate 4. A first holder 10 is fixed on the substrate 4 for camera with an adhesive 5 so as to cover the chip 6. In this case, the adhesive 5 for fixing the substrate 10 is also made to flow into the gap between the chip 6 and the substrate 4, so that the adhesive 5 is used for fixing the holder 10 and is allowed to function as reinforcing member for mounting the chip 6 on the substrate 4.