LIGHT-EMITTING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a light-emitting semiconductor device comprising a low-cost and high-function package structure. SOLUTION: The package structure for the light-emitting semiconductor device is provided with an insulating substrate and a light emitting diode. The light emitting diode is provided with a substrate, a first-form semiconductor layer which is provided with a first electrode region and which is formed on the substrate, a second-form semiconductor layer which is provided with a second electrode region and which is formed on the first-form semiconductor layer, a first electrode formed in the first electrode region and a second electrode formed in the second electrode region. The light emitting diode is fixed onto the insulating substrate by using a flip-chip method, and it can be surface- mounted by forming two electrode layers on both end side faces of the insulating substrate.