发明名称 |
Platen assembly having a topographically altered platen surface |
摘要 |
An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
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申请公布号 |
US2003032379(A1) |
申请公布日期 |
2003.02.13 |
申请号 |
US20010925254 |
申请日期 |
2001.08.08 |
申请人 |
LAM RESEARCH CORPORTION |
发明人 |
TAYLOR TRAVIS R.;XU CANGSHAN;CROFTON KEVIN T.;ZHAO EUGENE YUEXING |
分类号 |
B24B7/04;B24B21/06;B24B37/04;(IPC1-7):B24B23/00 |
主分类号 |
B24B7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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