发明名称 Platen assembly having a topographically altered platen surface
摘要 An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
申请公布号 US2003032379(A1) 申请公布日期 2003.02.13
申请号 US20010925254 申请日期 2001.08.08
申请人 LAM RESEARCH CORPORTION 发明人 TAYLOR TRAVIS R.;XU CANGSHAN;CROFTON KEVIN T.;ZHAO EUGENE YUEXING
分类号 B24B7/04;B24B21/06;B24B37/04;(IPC1-7):B24B23/00 主分类号 B24B7/04
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