| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that all of the densification of wiring, insulation/ continuity reliability and high frequency transmission characteristics cannot be satisfied in an insulating film comprising an organic material, and a multilayered wiring board using the same. SOLUTION: The insulating film 3 is constituted by forming coating layers 2 comprising a polyphenylene ether type organic substance on the upper and rear surfaces of a liquid crystal polymer layer 1 of which the contact angle with triallyl isocyanurate is 3-50 deg.. The multilayered wiring board 6 is constituted by laminating a plurality of the insulating films 3 each having a wiring conductor 4 comprising a metal foil arranged to at least one surface of the upper and rear surfaces thereof, and electrically connecting the wiring conductors 4 positioned up and down so as to hold the insulating films 3 through the piercing conductors 5 formed to the insulating films 3. |
