| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicone rubber adhesive composition which has good adherence to a thermoplastic resin and is suitable for molding without priming to give such an integrated molding of a silicone rubber and a thermoplastic resin that can be simply molded by, e.g. injection molding in a short time. SOLUTION: The adhesive composition contains (A) 100 pts.wt. of a thermally curable organopolysiloxane composition, (B) 1-100 pts.wt. of a fine reinforcing silica powder, (C) 0.1-50 pts.wt. of an organic compound or organosilicon compound having an epoxy equivalent of 100-5,000 g/mol and containing at least one aromatic ring in the molecule, and (D) 0.1-50 pts.wt. of a nonfunctional phenyl group-containing silicone oil.
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