| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive sheet which works as a dicing tape in the stage of dicing and exhibits an excellent connection reliability in the stage of bonding a semiconductor element to a support member; and a production method whereby the stage of producing a semiconductor device can be simplified. SOLUTION: This adhesive sheet, which is thermally polymerizable and radiation-polymerizable, comprises a substrate layer and a hardenable pressure- sensitive adhesive layer containing (A) an epoxy resin, (B) a modified polyamideimide resin prepared by reacting a mixture of (a) an aromatic polyisocyanate, (b) a tricarboxylic acid having an acid anhydride group, and (c) a dicarboxylic acid represented by formula (I) in a polar solvent, and (C) a radiation-polymerizable compound.
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