发明名称 CURABLE POLYSULPHIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a curable polysulphide composition which is usable as a sealant, not easily destroyed, and keeps excellent durability for a long term by properly suppressing increase of modulus of the executed sealant when heated. SOLUTION: This curable polysulphide composition comprises a polysulphide polymer having >=2 thiol groups in a molecule, a curing agent and an epoxy resin. The epoxy resin is preferably a bisphenol-based epoxy resin and the curing agent is preferably lead dioxide.
申请公布号 JP2003041120(A) 申请公布日期 2003.02.13
申请号 JP20010231769 申请日期 2001.07.31
申请人 BRIDGESTONE CORP 发明人 HIRAIWA TOSHIHIKO
分类号 C08L81/04;C08K3/22;C08L63/00;(IPC1-7):C08L81/04 主分类号 C08L81/04
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