发明名称 POLYAMIDE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide composition having excellent molding properties, tenacity, lightness, resistance to hot water, thermal resistance, mechanical properties, reduced water absorptivity, chemical resistance, melt stability, and enabling a low temperature metal mold cooling by using steam or a hot-water heating type mold and giving a molded article having sufficient crystallinity, thermal resistance, tenacity, dimensional stability at high temperature. SOLUTION: This polyamide composition comprises (A) 50-90 pts.wt. of a semi-aromatic polyamide comprising dicarboxylic acid unit including 60-100 mol% of terephthalic acid unit and diamine unit including 60-100 mol% of 1,9-nonanediamine unit and/or 2-methyl-1, 8-octanediamine unit and (B) 50-10 pts.wt. of an aliphaticpolyamide having 7-12 carbons per amide group.
申请公布号 JP2003041117(A) 申请公布日期 2003.02.13
申请号 JP20020145765 申请日期 2002.05.21
申请人 KURARAY CO LTD 发明人 UCHIDA KOICHI;HARA TETSUYA
分类号 C08J5/00;C08K3/22;C08L77/06;(IPC1-7):C08L77/06 主分类号 C08J5/00
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