| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which improves problems caused by formation of voids such as bubbles during processing and molding, especially foaming, speckiness aggregation, voids, particle falling off, etc., during the formation of a film in the resin composition. SOLUTION: This resin composition comprises a resin and inorganic particles. The resin composition is characterized in that the relationship of|γpowder-γpolymer|<=10 mN/m holds between the surface tension (γpowder) of the inorganic particles and the surface tension (γpolymer) of the resin. A molded product is obtained from the resin.
|
