发明名称 WOOD FLOORING
摘要 PROBLEM TO BE SOLVED: To provide a wood flooring which is excellent in flaw resistance, difficult to generate a recessed warpage, excellent in dimensional stability, good in thermal conductivity and suitable for floor heating. SOLUTION: A plywood 1 having dimensional stability to heat is arranged to a central part. A wood fiber board 2 of a high specific gravity is stuck to a front surface of the plywood 1 to improve a surface hardness and flaw resistance. Besides, the wood fiber board 3 is stuck also to a rear surface to balance a shrinkage by those front and rear wood fiber boards 2 and 3 and generation of a recessed warpage is avoided. Further, a decorative veneer 4 to the front surface and backing veneer are stuck respectively to the rear surface to form a thin flooring of 5 to 9 mm in total thickness and a thermal conductivity is improved.
申请公布号 JP2003039403(A) 申请公布日期 2003.02.13
申请号 JP20010227487 申请日期 2001.07.27
申请人 DAIKEN TRADE & IND CO LTD 发明人 NONO SHOICHI;KAKEHI MASAYUKI
分类号 B27D1/04;B27M3/04;B32B21/13;(IPC1-7):B27D1/04 主分类号 B27D1/04
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