发明名称 |
Thin film capillary process and apparatus |
摘要 |
Method and system of forming microfluidic capillaries in a variety of substrate materials. A first layer of a material such as silicon dioxide is applied to a channel etched in substrate. A second, sacrificial layer of a material such as a polymer is deposited on the first layer. A third layer which may be of the same material as the first layer is placed on the second layer. The sacrificial layer is removed to form a smooth walled capillary in the substrate.
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申请公布号 |
US2003029723(A1) |
申请公布日期 |
2003.02.13 |
申请号 |
US20000732004 |
申请日期 |
2000.12.06 |
申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
YU CONRAD M. |
分类号 |
B01L3/00;B81B1/00;(IPC1-7):B01L3/02 |
主分类号 |
B01L3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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