发明名称 Thin film capillary process and apparatus
摘要 Method and system of forming microfluidic capillaries in a variety of substrate materials. A first layer of a material such as silicon dioxide is applied to a channel etched in substrate. A second, sacrificial layer of a material such as a polymer is deposited on the first layer. A third layer which may be of the same material as the first layer is placed on the second layer. The sacrificial layer is removed to form a smooth walled capillary in the substrate.
申请公布号 US2003029723(A1) 申请公布日期 2003.02.13
申请号 US20000732004 申请日期 2000.12.06
申请人 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA 发明人 YU CONRAD M.
分类号 B01L3/00;B81B1/00;(IPC1-7):B01L3/02 主分类号 B01L3/00
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