| 摘要 |
The invention provide highly reliable semiconductor devices that realize further miniaturization and higher density. The invention also provides methods for manufacturing such semiconductor devices. A semiconductor device in accordance with the present invention includes a first semiconductor chip disposed face-down on a surface of a tape substrate, and a second semiconductor chip disposed face-up on a rear surface of the first semiconductor chip. The semiconductor device is equipped with a wiring pattern formed on a surface of the tape substrate, solder bumps formed on a rear surface of the tape substrate, solder balls of the first semiconductor chip connected to the wiring pattern, bonding pads formed on a surface of the second semiconductor chip, bonding wires that connect the bonding pads and the wiring pattern, and a resin that seals the surface of the tape substrate, the bonding wires, and the first and second semiconductor chips.
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