| 摘要 |
A method for fabricating an organic light-emitting device comprises in turn the steps of: providing a substrate; forming a first electrode corresponding to a light emission area; forming a stripe-shaped photoresist layer on the substrate having the first electrode wherein the photoresist layer is above the substrate having the first electrode; depositing an organic light-emitting medium layer on the first electrode in the exposed areas between the stripe-shaped photoresist layers to form a plurality of first electrode areas including the organic light-emitting medium layer on the first electrode; forming a second electrode on the organic light-emitting medium; forming a stress-relief layer on the second electrode wherein the stress-relief layer is a thin film of silicon oxynitride or polymer; and forming a passivation layer on the stress-relief layer wherein the passivation layer is an amorphous silicon, an inorganic nitride or an inorganic oxide.
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