发明名称 Semiconductor device and method of manufacturing the same
摘要 There can be provided a semiconductor device having a rough surface to provide an increased capacitance of a capacitor and enhanced prevention of short-circuit between capacitors, and a method of manufacturing the same. The semiconductor device includes a plug interconnection penetrating an insulating film and connected to an underlying wiring, and a storage node having a lower portion overlying the insulating film and free of a rough surface, and connected to the plug interconnection, and an upper portion overlying the lower portion of the storage node without covering a side surface of the lower portion of the storage node, and having a rough surface.
申请公布号 US2003030095(A1) 申请公布日期 2003.02.13
申请号 US20020271580 申请日期 2002.10.17
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 FUJIISHI YOSHITAKA;TANAKA YOSHINORI;HASUNUMA EIJI
分类号 H01L21/8242;H01L21/02;H01L27/108;(IPC1-7):H01L21/824;H01L29/76;H01L31/119 主分类号 H01L21/8242
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