| 发明名称 |
ELECTRONIC ASSEMBLY INCLUDING A DIE HAVING AN INTEGRATED CIRCU IT AND A LAYER OF DIAMOND AND METHODS OF PRODUCING THE SAME |
| 摘要 |
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die. |
| 申请公布号 |
WO03012864(A1) |
申请公布日期 |
2003.02.13 |
| 申请号 |
WO2002US24441 |
申请日期 |
2002.07.31 |
| 申请人 |
INTEL CORPORATION |
发明人 |
CHRYSLER, GREGORY, M.;WATWE, ABHAY, A.;AGRAHARAM, SAIRAM;RAVI, KRAMADHATI, V.;GARNER, C. MICHAEL |
| 分类号 |
H01L23/34;H01L21/20;H01L21/762;H01L23/373 |
主分类号 |
H01L23/34 |
| 代理机构 |
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