发明名称 Method of forming film pattern, device for forming film pattern, conductive film wiring, electro-optical device, electronic device, and non-contact card medium
摘要 The present invention provides a method of forming a functional film pattern which allows the forming of fine film patterns with simplified steps. The present invention also provides a method of forming a functional film pattern where such defects as disconnection and short circuit rarely occurs, and forming a pattern which has a large thickness and is good for exhibiting a function such as electric conduction can be formed.
申请公布号 US2003030689(A1) 申请公布日期 2003.02.13
申请号 US20020179387 申请日期 2002.06.26
申请人 SEIKO EPSON CORPORATION 发明人 HASHIMOTO TAKASHI;FURUSAWA MASAHIRO
分类号 B05C5/00;B05D1/26;B05D3/02;B05D5/12;B41J2/01;G02F1/13;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01L21/00;H01L21/288;H01L21/31;H01L21/336;H01L21/768;H01L29/786;(IPC1-7):B41J2/015;B41J29/38;H01L21/44 主分类号 B05C5/00
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