METHOD OF HEAT−PEELING CHIP CUT PIECES FROM HEAT PEEL TYPE ADHESIVE SHEET,ELECTRONIC PART,AND CIRCUIT BOARD

摘要

A method of heat peeling chip cut pieces(3a)from a heat peel type adhesive sheet(2)is a method by which chip cut pieces(3a)stuck to the heat peel type adhesive sheet(2)provided with a thermally expansible adhesive layer(2b)containing thermally expansible fine particles on one side of a substrate(2a)are peeled by heat from the heat peel type adhesive sheet(2),the method being characterized in that the heat peel type adhesive sheet(2)is heated in a restrained state and the chip cut pieces(3a)are peeled,wherein the means for restraining the heat peel type adhesive sheet(2)may be a suction means using suction or a adhesive means using an adhesive agent.Thereby,it is possible to heat−peel the chip cut pieces(3a)from the heat peel type adhesive sheet(2)while preventing horizontal positional shift.