发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having excellent photosensitivity so that its hardened material is excellent in bending property, adhesion property, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance against gold plating or the like. SOLUTION: A polyester compound (E) soluble with an alkali aqueous solution is obtained by the reaction of the following compound (A), compound (B) and compound (D) and as an optional component, compound (C). The photosensitive resin composition using the compound (E), and its hardened material are provided. The compound (A) is an epoxy carboxylate compound obtained by the reaction of an epoxy compound (a) having two epoxy groups in the molecule and a monocarboxylic acid compound (b) having an ethylenic unsaturated group in the molecule. The compound (B) is a butadiene-acrylonitrile copolymer having a hydroxy group at the molecular end. The compound (C) is a diol component except the compound (A) and compound (B). The compound (D) is a polybasic acid anhydride.
申请公布号 JP2003043684(A) 申请公布日期 2003.02.13
申请号 JP20010236324 申请日期 2001.08.03
申请人 NIPPON KAYAKU CO LTD 发明人 TANAKA RYUTARO;KOYANAGI TAKAO
分类号 G03F7/027;C08F283/01;C08G63/52;G02B6/12;G03F7/038;H05K3/18;H05K3/28;H05K3/46 主分类号 G03F7/027
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