发明名称 SUBSTRATE FOR ROTARY CUTTING EDGE, ROTARY CUTTING EDGE AND ROTARY CUTTER FOR CUTTING HARD MATTER USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate for a rotary cutting edge to be used for the rotary cutting edge for cutting hard matter including ceramics and metal without generating deflection in a ring-shaped disc part, even if rotating the rotary cutting edge at high speed. SOLUTION: This substrate for the rotary cutting edge has the ceramics ring-shaped disc part 2 showing a melting phenomenon by absorbing laser beam and an abrasive grain binding layer fixing region for fixing an abrasive binding layer 6 stipulated on an outer peripheral part 4 of the ring-shaped disc part 2 and made of metal or resin including abrasive grain.
申请公布号 JP2003039327(A) 申请公布日期 2003.02.13
申请号 JP20010235509 申请日期 2001.08.02
申请人 MASHIINA:KK 发明人 HIRAI AKIRA
分类号 B24B27/06;B24D3/00;B24D3/06;B28D1/24;H01L21/301;(IPC1-7):B24D3/00 主分类号 B24B27/06
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