发明名称 |
SUBSTRATE FOR ROTARY CUTTING EDGE, ROTARY CUTTING EDGE AND ROTARY CUTTER FOR CUTTING HARD MATTER USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a rotary cutting edge to be used for the rotary cutting edge for cutting hard matter including ceramics and metal without generating deflection in a ring-shaped disc part, even if rotating the rotary cutting edge at high speed. SOLUTION: This substrate for the rotary cutting edge has the ceramics ring-shaped disc part 2 showing a melting phenomenon by absorbing laser beam and an abrasive grain binding layer fixing region for fixing an abrasive binding layer 6 stipulated on an outer peripheral part 4 of the ring-shaped disc part 2 and made of metal or resin including abrasive grain. |
申请公布号 |
JP2003039327(A) |
申请公布日期 |
2003.02.13 |
申请号 |
JP20010235509 |
申请日期 |
2001.08.02 |
申请人 |
MASHIINA:KK |
发明人 |
HIRAI AKIRA |
分类号 |
B24B27/06;B24D3/00;B24D3/06;B28D1/24;H01L21/301;(IPC1-7):B24D3/00 |
主分类号 |
B24B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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