| 摘要 |
PROBLEM TO BE SOLVED: To compensate a Z-directional displacement quantity of a probe caused by deformation of a probe card due to a contact pressure of the probe and to always keep a contact pressure between the probe and an electrode pad of a semiconductor device constant for measuring electric characteristics in a stable condition. SOLUTION: This prober is provided with a correction mechanism 4 measuring a quantity t of a clearance, which is generated between the probe card and a card holder 3 by deformation of the probe card due to the contact pressure between the probe 2a in the probe card 2 and the electrode pad in the semiconductor device, by means of an air gauge for finding the Z-directional displacement quantity d and correcting the Z-directional position of a chuck mechanism 1 for a wafer 10 so that the displacement quantity d is compensated for keeping the contact pressure constant.
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