发明名称 THERMAL ANALYSIS METHOD AND DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a thermal analysis method and a device, capable of determining temperature distribution in a widely usable way, regardless of the shape of object body. SOLUTION: In this thermal analysis device, object region segmentation for segmenting the object shape for thermal analysis into a finite number of finite elements or cells is performed, and the thermal analysis of the object region is conducted by using the segmentation result. In the device, the temperature distribution in the object is determined as follows: the temperature distribution in the object is determined using a thermal conductivity by a temperature distribution calculation part 22; the temperature at a specific point is determined, based on the determined temperature distribution by a specific point temperature calculation part 23; deviation between the determined temperature at the specific point and a target temperature, set beforehand at the specific point, is determined by a deviation calculation/determination part 24; it is discriminated whether or not the deviation is within a prescribed range; when the deviation is discriminated to be out of the prescribed range, the thermal conductivity is changed by a thermal conductivity renewal part 25; and such an operation is repeated, until the deviation falls within the prescribed range.
申请公布号 JP2003042984(A) 申请公布日期 2003.02.13
申请号 JP20010235556 申请日期 2001.08.02
申请人 HONDA MOTOR CO LTD 发明人 OGINO TAKASHI;MURAKAMI HIROTAKA
分类号 G01N25/18;G06F17/12;G06F17/18;(IPC1-7):G01N25/18 主分类号 G01N25/18
代理机构 代理人
主权项
地址