| 摘要 |
<p>A semiconductor device in which noise appearing at a terminal provided on a semiconductor substrate is reduced. The semiconductor device (10) comprises a rectangular semiconductor substrate (11), constituent components (12) disposed on the semiconductor substrate (11), and terminals (22) including a power supply terminal (20) and a ground terminal both disposed along the periphery of the semiconductor substrate (11). The constituent components (12) include a bypass capacitor (14), one end of which is connected to the power supply terminal (20) and the other of which is connected to the ground terminal (22). An inductive component (30) is provided outside of the semiconductor substrate (11). One end of the inductive component (30) is connected to the power supply terminal (20), and the other end is connected to a power supply circuit (40).</p> |
