发明名称 HEAT TREATMENT APPARATUS, HEAT TREATMENT SYSTEM, HEAT TREATMENT METHOD, HEAT TREATMENT CONDITIONS SETTING PROGRAM, AND COMPUTER READABLE RECORDING MEDIUM RECORDING THE PROGRAM
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus, a heat treatment system, a heat treatment method, a heat treatment conditions setting program, and a computer readable recording medium recording therein the foregoing program capable of easily setting optimum heat treatment conditions for each workpiece article without taking labor and time. SOLUTION: In a heat treatment system 20 composed of a heat treatment apparatus 1 and a control device 3, the heat treatment apparatus 1 comprises a heat treatment mechanism section 7 for heat treating a workpiece article, and a control section 6 for controlling the heat treatment mechanism section 7. The control device 3 includes control quantity setting means 14 which receives inputs of a temperature profile condition of the workpiece article and characteristic data of the workpiece article itself, sets the quantity of control for the heat treatment mechanism section 7 based upon the temperature profile conditions and the characteristic data, and outputs it to the control section 6.
申请公布号 JP2003042665(A) 申请公布日期 2003.02.13
申请号 JP20010229726 申请日期 2001.07.30
申请人 SONY CORP 发明人 INOUE YUJI
分类号 B23K3/04;F27B9/40;F27D19/00;H05K3/34;(IPC1-7):F27B9/40 主分类号 B23K3/04
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