发明名称 SUBSTRATE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To appropriately supply two sorts of gases to be activated and not to be activated, to a reaction chamber, without activating the gas not to be activated, even when the two gases are fed into a common feeding system which is accompanied by an activation means. SOLUTION: This substrate treatment apparatus comprises arranging a common pipe 8 for supplying the gas into the reaction chamber 2 for treating a substrate; the common feeding system L8 for passing the gas to be activated and the gas not to be activated, which are individually supplied through the individual pipes 6 and 7; arranging an activation means 13 in the common pipe 8, which has a function of activating the gas flowing through the common pipe 8; and a controlling means 14 for controlling opening and closing of controlling valves 11 and 12 installed in the individual pipes 6 and 7, and for making the activation means 13 work, when the gas to be activated flows into the common pipe 8, and stopping or decreasing the function of the activation means 13, when the gas not to be activated flows.
申请公布号 JP2003041367(A) 申请公布日期 2003.02.13
申请号 JP20010234899 申请日期 2001.08.02
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SAKAI MASANORI;KAGAYA TORU;MORITA SHINYA
分类号 C23C16/455;H01L21/31;(IPC1-7):C23C16/455 主分类号 C23C16/455
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