| 摘要 |
A pick-up tool for the mounting of semiconductor chips onto a substrate has a suction device which consists of a plate made out of a dimensionally stable material one surface of which has structures made of hardened adhesive. The material for the plate is, for example, aluminum, a carbon fiber composite material or a dimensionally stable plastic. A suitable material for the structure is, for example, an adhesive which has Teflon(R) as the filing material.
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