发明名称 |
Composite kinematic coupling |
摘要 |
The kinematic coupling of the present invention may comprise a wafer carrier or carrier base plate comprising a first material. The base plate or carrier is provided with a contact component comprising a second material having a lower co-efficient of friction than the first material. The contact component may be provided to the base plate or directly to the bottom of a wafer carrier as part of an overmolding, snap-in-place, staking, ultrasonic weld or adhesive operation and may additionally be held in place by mechanical interlocking of the respective components. The method of manufacturing may include providing a contact component comprised of a first material to a carrier component comprised of a second material via one or more of the processes listed above, wherein the second material has a higher coefficient of friction than the first.
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申请公布号 |
US2003029765(A1) |
申请公布日期 |
2003.02.13 |
申请号 |
US20020212483 |
申请日期 |
2002.08.05 |
申请人 |
BHATT SANJIV M.;EGGUM SHAWN D. |
发明人 |
BHATT SANJIV M.;EGGUM SHAWN D. |
分类号 |
B29C45/14;B29C45/16;B29K69/00;B29K71/00;G03F7/20;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):B65D85/48 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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