发明名称 MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a technology for forming a composite oxide film, superior in resistance to metal stain and corrosion resistance to fluorinated acid and hydrochloric acid, on the surface of a member for a semiconductor manufacturing apparatus. SOLUTION: This manufacturing method includes forming the composite oxide film, by applying a slurry of silicon oxide-aluminum oxide-chromium oxide and a sintering additive which generates an amorphous inorganic material when baked, on a surface of a substrate, and by heating and baking it at 250-750 deg.C. The method also includes forming a precipitated layer of amorphous inorganic fine particles, by using a chromic acid aqueous solution containing the sintering additive.</p>
申请公布号 JP2003041383(A) 申请公布日期 2003.02.13
申请号 JP20020123846 申请日期 2002.04.25
申请人 TOKYO ELECTRON LTD;TOCALO CO LTD 发明人 SAITO YUKIMASA;SAKURAI HIROSHI;HASEBE KAZUHIDE;OKADA MITSUHIRO;ENDO ATSUSHI;ONODERA TOKUYUKI;OGAWA ATSUSHI;TANI KAZUMI;MIYAJIMA NARIYOSHI;TERATANI TAKEMA;HAMAGUCHI TATSUYA
分类号 C23C18/12;C23C24/08;C23C28/04;H01L21/205;H01L21/31;H01L21/68;H01L21/683;(IPC1-7):C23C28/04 主分类号 C23C18/12
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