| 摘要 |
The present invention provides schemes which are associated with wire bonding process or wire bonding machine to detect the bonding status of a bonding wire of a package including at least a semiconductor unit. The schemes are very useful to a BGA (Ball Grid Array) package or similar types of packages, and provide significant advantages particularly for a package in which the resistance (such as the resistance resulting from an adhesion layer and a layer of Cupric Oxide for promoting adhesion) between a semiconductor unit and its carrier is not low enough. The present invention is characterized in that a preset connection between a semiconductor unit and a package-connection-area (such as the solder ball pad of a ball grid array package) is established in the beginning of a wire bonding process, and the package-connection-area is electrically connected with a press plate used by the wire bonding machine or the wire bonding process, so that a current loop can be formed via a bonding wire, the preset connection, the package-connection-area, and the press plate when the bonding wire is bonded to a semiconductor unit, and the bonding status between the bonding wire and the semiconductor unit can be indicated according to the current flowing through the current loop. The present invention is also applicable to the detection of bonding status between a bonding wire and a bonding finger electrically connected to a package-connection-area of the package.
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