发明名称 LOCAL INTERCONNECT JUNCTION ON INSULATOR (JOI) STRUCTURE
摘要 A JOI structure and cell layout including at least one patterned gate stack region present atop a semiconductor substrate, said semiconductor substrate having source/drain diffusion regions of opposite dopant polarity abutting each other present therein, said source/drain diffusion regions are present atop an insulating layer, said insulating layer not being present beneath said at least one patterned gate stack region. An alternative JOI structure and cell layout of the present invention includes at least one patterned gate stack region present atop a semiconductor substrate, said semiconductor substrate containing at least a conductive region other than source/drain diffusion regions present atop an insulating layer embedded therein, said insulating layer not being present beneath said at least one patterned gate stack region, wherein said conductive region is in contact with vertical sidewalls of source/drain extension regions present in said semiconductor substrate, beneath said at least one patterned gate stack region.
申请公布号 US2003030106(A1) 申请公布日期 2003.02.13
申请号 US20010928738 申请日期 2001.08.13
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MANDELMAN JACK A.;GAN DONG;LAM CHUNG H.
分类号 H01L21/768;H01L21/8234;H01L21/8244;H01L27/11;(IPC1-7):H01L27/01;H01L27/12;H01L31/039 主分类号 H01L21/768
代理机构 代理人
主权项
地址