| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of independently controlling each of pressing force of wafer and a retainer ring and having a wafer carrier without deteriorating working flatness by moment load due to lateral direction force transmitted from a polishing pad and without being affected by flatness of a holding surface of the wafer. SOLUTION: The wafer carrier 14 of the wafer polishing device 10 is constituted of a carrier main body 22, the retainer ring 24 for supporting the wafer W during polishing in a peripheral direction, and a thin film member 26 for transmitting pressing force to the wafer W. The carrier main body 22 is provided with a first pressing means 28 using air pressure to press the thin film member 26, and is provided with a second pressing means 30 to press the retainer ring 24 downward by air pressure, separately from the first pressing means 28. |
