| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection method and an inspection device for a plastic wiring board capable of easily detecting a defective part of a wiring pattern, in an internal layer part covered with solder resist films. SOLUTION: In this inspection method, the defective parts of first and second wiring patterns 22, 22a, on both faces of the plastic wiring board 20 covered with the solder resist films 27, 27a, are detected. In the method, the board is placed on an observation table 12 having a transmission hole 16, so that the first wiring pattern 22 is positioned on the upper surface side, and lamp light is made to enter from the under surface side of the plastic wiring board 20 through the transmission hole 16, to thereby detect transmitted light through the defective part of the first wiring pattern 22 by a microscope 11; and then the plastic wiring board 20 is turned over, and the effective part of the second wiring pattern 22a is detected by a method similar to that of the first wiring pattern 22. This inspection device is equipped with the microscope, the observation table having the transmission hole on the center part, an illumination means provided below the transmission hole, and an illuminance adjustment means for adjusting the illuminance of light.
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