| 摘要 |
A method for filling a fine hole, having a hole pattern diameter of less than or equal to 0.18 mum, comprising the following steps of: (i) filling the fine hole with filler which is obtained by dissolving into an organic solvent a nitrogen-containing compound having mean molecular weight of less than or equal to 800 and containing at least one kind selected from melamine, benzoguanamine, acetoguanamine, glycol uryl, urea, thiourea, guanidine, alkyleneurea and succinylamide, in which hydrogen atoms of amino groups are substituted by at least one of hydroxyalkyl groups and alkoxyalkyl groups or both of the groups; (ii) drying the filler; and (iii) heating said filler at a temperature of 150-250° C., whereby no bubble is generated when the fine hole is filled.
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