| 摘要 |
<p>In present invention, a photonic integrated circuit (PIC) includes a planar structure comprising a substrate and a planar optical device such as a planar waveguide or a vertical cavity surface emitting laser (VCSEL) formed on top of the substrate. A fibre guiding layer of photoresist is formed on top of the planar optical device. Optical coupling ports etched into the fibre guiding layer allow for a vertical coupling between one end of an optical fibre and the planar optical device. If necessary a mirror or BRAGG grating is included in the optical coupling port to redirect the incoming light to a perpendicular direction. The other end of the optical fibre may be coupled to an optical fibre holder or to another optical coupling port. An important advantage of the present invention is the flexibility it gives to a designer since it eliminates the need to for waveguides to be routed to the edge of the chip. It also solves the problem of aligning a large number of fibres onto a chip since the optical coupling ports allow fibres to be passively aligned.</p> |
