摘要 |
An array apparatus has a micromachined SOI structure (22), such as a MEMS array, mounted directly on a class of substrate (24), such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes (26-29) disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes (26-29) are configured for substantial fanout and the electrodes (26-29) are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias (36-37) within a tolerance of position relative to electrodes (26-29) such that contact is not lost therebetween at the time of manufacturing.
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申请人 |
GLIMMERGLASS NETWORKS, INC. |
发明人 |
STAKER, BRYAN, P.;TEETER, DOUGLAS, L., JR.;DEBEY, THOMAS, A.;AMM, DAVID, T. |