Process for coating thermoplastic substrates with a coating composition containing a non-aggressive solvent

摘要

A process for coating a thermoplastic substrate which comprises applying a solvent based coating composition to the substrate and curing the coating composition at ambient temperature to 125° C. to form a uniform smooth film on the substrate;wherein the coating composition contains about 45-80% by weight of a film forming binder and 20-55% by weight of an organic liquid carrier; wherein the binder contains(A) 40-90% by weight, based on the weight of the binder, of a polymer selected from the following: acrylic polyol, polyester polyol, polyether polyol or a polyurethane polyol; and(B) 10-60% by weight, based on the weight of the binder, of an organic polyisocyanate crosslinking agent; andwherein the organic liquid carrier used in the coating composition comprises at least 50% by weight, based on the weight of the organic liquid carrier used in the coating composition, of tertiary butyl acetate; the process of this invention also can be used to apply lacquers, i.e., coating composition that do not contain a crosslinking agent such as a polyisocyanate.