发明名称 Method and apparatus of manufacturing non-resonance knock sensor
摘要 An apparatus of two stories for manufacturing a non-resonance knock sensor has an assembly body stage positioned at a first floor for forming an assembly body in which a lower insulator, a lower terminal plate, a piezoelectric element, an upper terminal plate and an upper insulator are mounted on a cylindrical base, and process stages positioned at a second floor for fastening the assembly body with a nut to form a sensor main body, bending partly the lower and upper terminal plates of the sensor main body and connecting by welding a resistor between the lower and upper terminal plates which are partly bent in the sensor main body. Accordingly, its manufacturing line is compact and can be installed in smaller horizontal ground area.
申请公布号 US2003029028(A1) 申请公布日期 2003.02.13
申请号 US20020214460 申请日期 2002.08.08
申请人 WATANABE YUSUKE;OHWAKI SHIGERU;YAMAUCHI TAKASHI;IWATA KATSUSHI 发明人 WATANABE YUSUKE;OHWAKI SHIGERU;YAMAUCHI TAKASHI;IWATA KATSUSHI
分类号 G01H11/08;B23P21/00;(IPC1-7):B23P19/00;H01C17/00;H04R17/00 主分类号 G01H11/08
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