| 摘要 |
<p>There is described heat dissipation apparatus for dissipating heat from a heat producing component mounted within an enclosure. The apparatus is in the form of a casing which has an internal heat conducting surface which is in physical contact with the heat producing component. In this way, a heat conducting path from the component to the external surface of the casing is provided. This invention has particular application in computers, the heat generating component being a processor.</p> |
