| 摘要 |
<p>An array apparatus has a micromachined SOI structure (22), such as a MEMS array, mounted directly on a class of substrate (24), such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes (26-29) disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes (26-29) are configured for substantial fanout and the electrodes (26-29) are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias (36-37) within a tolerance of position relative to electrodes (26-29) such that contact is not lost therebetween at the time of manufacturing.</p> |
