| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder resistant resin layer having the thermal fatigue resistance to a heat history and temperature cycle test(TCT) in packaging, the moisture resistance to a high acceleration test (HAST), etc., and a wiring board using the same and an electronic device. SOLUTION: The solder resistant resin layer 3 is formed by curing a resin composition containing an epoxy resin mixture, thermal stress absorption particles A formed by using elastomer particles not compatible with the epoxy resin mixture as cores and coating the cores with the resin compatible with the epoxy resin mixture as a shell layer and inorganic insulative fillers of 0.1 to 2 μm in average grain size and the Erichsen value thereof is 5 to 15 mm. |
