| 摘要 |
<p>The present invention provides a process and apparatus (10)n for mounting semiconductor components (12) to substrates (20). More particularly, the apparatus (10) includes a placing mechanism (300) positioned on a support frame (40) for placing the semiconductor components (12) to the substrates (20). A reflow oven/furnace (400) is integrated into the apparatus (10), thereby eliminating the need to transport the semiconductor components (12) and substrates (20) to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array (200, 250) adapted for efficient application of suction to substrates (20) carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders (610) provided on substrates (20). (Fig.4).</p> |
