ELECTRO CERAMIC COMPONENTS

摘要

An array apparatus (10) has a micromachined SOI structure (12), such as a MEMS array, mounted directly on a class of insulative substrate (18-1, 18-n), such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes (26, 28, 30, 32) disposed in alignment with the individual MEMS elements, where the electrostatic electrodes (26, 28, 30, 32) are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges (242) and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.