发明名称 ETCHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: An etching apparatus for manufacturing a semiconductor device is provided to obtain more reliable temperature data of a process chamber independent of RF(Radio Frequency) power and to control temperature precisely by minimizing temperature deviation of the process chamber. CONSTITUTION: The process chamber(10) of an etching apparatus has an upper chamber(11) and a lower chamber(12), in which a cooling line passes through each chamber for preventing overheat of the chamber. A temperature sensor(30) is provided at the drain port of the cooling line(22) passing through the lower chamber(12). Another temperature sensor(30) is provided at the drain port of the cooling line(21) passing through the upper chamber(11), in which the temperature sensor(30) is located outside the process chamber(10). The location of the temperature sensor(30) in the upper chamber prevents interference of RF power.
申请公布号 KR20030012475(A) 申请公布日期 2003.02.12
申请号 KR20010046504 申请日期 2001.08.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KOO, DO SEO
分类号 H01L21/3065;(IPC1-7):H01L21/306 主分类号 H01L21/3065
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