发明名称 MEMORY MODULE HAVING INCREASED MOUNT AREA
摘要 PURPOSE: A memory module having an increased mount area is provided to increase a mount area for mounting components by forming a groove portion on an edge of a component mount restricted area to mount the components. CONSTITUTION: A memory module is formed with a plurality of surface mount components, a printed circuit board(300), and an EEPROM(310). A component mount restricted area is formed on the printed circuit board(300). A groove portion is formed within the component mount restricted area. The EEPROM(310) is mounted on a groove portion within a component mount restricted area in order to generate an increased mount area for mounting the surface mount components. A package having pins arranged to only one direction is used for the EEPROM(310) in order to mount the EEPROM(310) the groove portion.
申请公布号 KR20030012736(A) 申请公布日期 2003.02.12
申请号 KR20010047149 申请日期 2001.08.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JIN SEONG
分类号 H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/50
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