发明名称 |
MEMORY MODULE HAVING INCREASED MOUNT AREA |
摘要 |
PURPOSE: A memory module having an increased mount area is provided to increase a mount area for mounting components by forming a groove portion on an edge of a component mount restricted area to mount the components. CONSTITUTION: A memory module is formed with a plurality of surface mount components, a printed circuit board(300), and an EEPROM(310). A component mount restricted area is formed on the printed circuit board(300). A groove portion is formed within the component mount restricted area. The EEPROM(310) is mounted on a groove portion within a component mount restricted area in order to generate an increased mount area for mounting the surface mount components. A package having pins arranged to only one direction is used for the EEPROM(310) in order to mount the EEPROM(310) the groove portion.
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申请公布号 |
KR20030012736(A) |
申请公布日期 |
2003.02.12 |
申请号 |
KR20010047149 |
申请日期 |
2001.08.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, JIN SEONG |
分类号 |
H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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