METHOD FOR CLEANING SEMICONDUCTOR DEVICE USING LASER

摘要

PURPOSE: A method for cleaning a semiconductor device using laser is provided to reduce a time for cleaning process by minimizing the scanning number of a semiconductor substrate. CONSTITUTION: A semiconductor substrate(104) is transferred into a cleaning chamber(100). The semiconductor substrate(104) is loaded by a rotation and transfer unit(102). A laser beam irradiation device(106) irradiates a line laser beam(110) on a surface of the semiconductor substrate(104) through a laser beam irradiation hole(108). The energy of the line laser beam(110) is controlled according to thermal characteristics of elements formed on the semiconductor substrate(104). In a cleaning process, particles are separated from the semiconductor substrate(104). An adhesion of the particles on the semiconductor substrate(104) is prevented by using a purge gas(112). The gas generated from the cleaning chamber is exhausted to an exhaust hole(114).