发明名称 CHEMICAL MECHANICAL POLISHER HAVING PROTECTION PART FORMED ON SPINDLE PART
摘要 PURPOSE: A chemical mechanical polisher having a protection part formed on a spindle part is provided to protect the spindle part from an abrasive by installing the protection part on the spindle part. CONSTITUTION: A chemical mechanical polisher(200) includes a flat plate table(210) and an abrasive supply portion(250). A polishing pad(215) is adhered on an upper portion of the flat plate table(210). The abrasive supply portion(250) provides an abrasive(255) to a polishing pad(215). The spindle part(230) has a vacuum tube(235). A driving portion(240) is located at an upper side of the spindle portion(230). The driving portion(240) includes a driving motor and a piston portion. A protection part(260) are installed at a spindle part(230) of the chemical mechanical polisher(200). A protection plate(263) is adhered at a bottom face of the spindle portion(260). A combination portion(265) is used for fixing the protection plate(263) and the spindle portion(230).
申请公布号 KR20030012292(A) 申请公布日期 2003.02.12
申请号 KR20010046266 申请日期 2001.07.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, YEONG JIN
分类号 H01L21/302;(IPC1-7):H01L21/302 主分类号 H01L21/302
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