发明名称 |
CHEMICAL MECHANICAL POLISHER HAVING PROTECTION PART FORMED ON SPINDLE PART |
摘要 |
PURPOSE: A chemical mechanical polisher having a protection part formed on a spindle part is provided to protect the spindle part from an abrasive by installing the protection part on the spindle part. CONSTITUTION: A chemical mechanical polisher(200) includes a flat plate table(210) and an abrasive supply portion(250). A polishing pad(215) is adhered on an upper portion of the flat plate table(210). The abrasive supply portion(250) provides an abrasive(255) to a polishing pad(215). The spindle part(230) has a vacuum tube(235). A driving portion(240) is located at an upper side of the spindle portion(230). The driving portion(240) includes a driving motor and a piston portion. A protection part(260) are installed at a spindle part(230) of the chemical mechanical polisher(200). A protection plate(263) is adhered at a bottom face of the spindle portion(260). A combination portion(265) is used for fixing the protection plate(263) and the spindle portion(230).
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申请公布号 |
KR20030012292(A) |
申请公布日期 |
2003.02.12 |
申请号 |
KR20010046266 |
申请日期 |
2001.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, YEONG JIN |
分类号 |
H01L21/302;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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